- Thin film preparation
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Horizontal CVD Thin Film Prepa
- Stripping Equipment
- Automated equipment
- Cleaning equipment
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Fully automatic edge cleaning machine
- Special gas equipment
- Material accessories
Intelligent Leadership, Global Reach
Intelligent Leadership, Global Reach
Intelligent Leadership, Global Reach
Intelligent Leadership, Global Reach
Intelligent Leadership, Global Reach
Intelligent Leadership, Global Reach
Chemical Vapor Deposition (CVD) is a key technology for producing high-purity, high-performance solid thin films. In a typical CVD process, one or more gaseous reactive precursors are introduced into a reaction chamber, where chemical reactions are triggered by external energy sources (such as heat, light, or plasma). As a result, a solid thin film is deposited onto the surface of a substrate. This technology offers outstanding advantages, including high film quality, controllable composition, and excellent reproducibility. Therefore, it is widely adopted for thin film preparation across various materials and application fields.
Etching equipment is a key enabling technology for micro/nano patterning. It selectively removes materials from the substrate surface through physical or chemical mechanisms, enabling the precise transfer of patterns from the mask to the substrate. Based on the process principle, etching is primarily classified into dry etching and wet etching. Among these, dry etching, with its excellent anisotropy and high precision control, has become the mainstream technology for advanced semiconductor manufacturing.
Semiconductor automation equipment is a critical support system that runs throughout the entire chip manufacturing process, encompassing functional modules such as wafer transfer, process control, and inspection integration. Through automated handling, real-time scheduling, and data coordination, this equipment effectively improves production line efficiency, process consistency, and yield. It serves as the core enabler for advancing front-end manufacturing and back-end packaging toward high-precision, high-volume production.
Semiconductor cleaning equipment is the most frequently used process equipment throughout the entire chip manufacturing process. Based on process principles, it is mainly divided into three major series: wet cleaning equipment (batch and single-wafer types), dry cleaning equipment (plasma-based and vapor-phase), and advanced cleaning equipment (supercritical CO₂ and laser-based). By efficiently removing particles, metallic impurities, and organic contaminants, this type of equipment provides the core assurance for improving chip yield and reliability.
Semiconductor specialty gas equipment is a critical infrastructure responsible for the supply, distribution, and safety assurance of specialty gases in chip manufacturing. This system encompasses three major functional modules: gas storage and delivery, purification and distribution, and safety monitoring. It ensures that the high-purity gases required for processes such as deposition and etching are delivered to the process tools safely, stably, and precisely. With high-cleanliness gas lines, precise flow control, and multi-level safety interlocks, semiconductor specialty gas equipment provides the core assurance for process stability and production safety.
Semiconductor materials and components are high-purity, high-precision consumables and parts widely used throughout the chip manufacturing process. They fall into five major categories: high-purity fluid management components, vacuum system components, process chamber components, wafer carriers and transfer parts, and cleanroom consumables. Manufactured with precision engineering and strict contamination control, these components play a critical role in ensuring process stability, extending equipment uptime, and controlling particulate contamination. They serve as an indispensable foundation of the semiconductor manufacturing chain.
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