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MSW Showcases New Semiconductor Equipment at the 22nd IC China 2025

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November 22–25, 2025 – Beijing – The 22nd China International Semiconductor Expo (IC China 2025) was grandly held at the Beijing National Convention Center. As a key platform for global semiconductor industry exchange, the Expo brought together numerous leading companies and cutting-edge technological achievements. Under the theme "Insight Through Micro – A Smarter World," MicroWorld Semiconductor made a brilliant appearance, showcasing a range of high-performance, low-power chip manufacturing equipment and one-stop solutions, quickly becoming one of the most talked-about highlights on the opening day.

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At the Expo, MicroWorld Semiconductor systematically presented its comprehensive product portfolio in the semiconductor equipment field, covering key processes such as thin-film deposition, lithography support, photoresist removal, specialty gas delivery, and vacuum systems. Among these, new thin-film deposition tools — including vertical CVD, horizontal CVD, and PECVD — drew significant attention from professional attendees and industry experts due to their in-depth applications in semiconductors, integrated circuits, and silicon-based micro-displays.

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Throughout the Expo, MicroWorld Semiconductor assembled a team of technical experts who engaged in in-depth discussions with clients regarding the company's development history, product advantages, and industry application scenarios. Addressing the practical pain points customers face in chip manufacturing processes, the team provided customized solutions, fully embodying the company's mission: "Customer-needs-driven innovation, customized application solutions, and personalized service."


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