4-Tube Horizontal CVD

Technical Specifications：

Wafer Size: 4–6 inches

Applicable Material: Silicon

Applicable Processes (for Silicon):POLY, Si₃N₄, TEOS, etc.

Application Areas: Integrated Circuits, Semiconductors, Silicon-based Microdisplays

Features of the equipment：

High-precision computer-controlled technology enables full-process monitoring.

Software is expandable to support MES and SECS functions.

All major components are sourced from internationally recognized leading brands.

Excellent thin film uniformity.

Advanced control software operating system.