On October 13, our company showcased multiple self-developed new equipment at the 2026 China Chip Exhibition, highlighting core equipment and process solutions for wafer processing, chip manufacturing, and advanced packaging.

Former Chairman of Hua Hong Group Zhang Suxin, President of Shanghai Polytechnic University Xie Huaqing, and Party Secretary of the School of Integrated Circuits Chen Yong delivered speeches and held in-depth exchanges with Micro World Semiconductor Chairman Ding Bo, highly praising our company's sustained investment and practical achievements in industry-education integration and innovation.

At this expo, our booth focused on presenting a semiconductor product matrix, including the CVD thin-film preparation series, automated preparation series, Strip resist removal preparation series, specialty gas preparation series, and new electronic devices. Among them, core products such as vertical CVD, horizontal CVD, and PECVD new thin-film preparation systems attracted widespread attention, demonstrating deep applications in semiconductors, integrated circuits, and silicon-based microdisplays.

At the expo, the Micro World team worked in full-day rotations, engaging with customers to explore industry pain points, providing comprehensive briefings on the company, product advantages, and application areas, and delivering precise product solutions. The communication yielded fruitful results, fully reflecting the company's commitment to customer-centric values and its corporate philosophy of providing innovative products, customized application solutions, and personalized services.