Treatment Principle: Dry Adsorption
Max Gas Flow Rate: 200 SLM
Control System: PLC
Applicable Processes: MOCVD, PECVD, Etching Equipment, and other supporting tools
Application Areas: University Laboratories, Materials Analysis Laboratories, Semiconductor Chip Manufacturing
High treatment efficiency and strong adsorption capacity.
Simple and low-cost adsorbent replacement.
Easy after-sales service and low equipment failure rate.
Compact footprint – saves valuable installation space.
Equipped with an emergency backup canister that automatically switches to the emergency adsorption canister in case of main canister abnormality.
Features including inlet pressure monitoring, outlet pressure monitoring, and temperature detection – all integrated with safety interlock programs.