Automatic Edge Cleaner

Technical Specifications：

Wafer Size: 6–8 inches

Edge Removal Accuracy: 0.6 mm
Standard Configuration: In accordance with SEMI-S2-93
Application Areas: Single-wafer etching, cleaning, and scrubbing processes for semiconductor materials such as silicon and silicon carbide (SiC)

Features of the equipment：

Two sets of mechanical suction cups for automatic wafer loading/unloading.

Robot transfers silicon wafers from the loading end to the lower suction cup; automatic alignment via HMI.

Control system uses imported brand PLC and HMI.

All electrical components and wiring that may come into contact with acid vapor are protected by PFA anti-corrosion isolation.

Front side of the system is equipped with one PTFE pure water gun and one PTFE nitrogen gun, both located on the right side.