Automatic Spin Coater

Technical Specifications：

Wafer Size: 3–6 inches

Dispense Position Accuracy: ≤0.2 mm
Rotation Accuracy: ≤1–4% RPM
Maximum Speed: 6,000 rpm
Acceleration: Adjustable within 0–5,000 rpm/sec
Coating Uniformity: Within-wafer ≤130 Å, Wafer-to-wafer ≤150 Å
Equipment Reliability: MWBF ≥ 10,000
Application Areas: Integrated Circuits, Semiconductors, Silicon-based Microdisplays

Features of the equipment：

PLC touchscreen control – low failure rate, high reliability, simple operation, easy maintenance

Automatic loading/unloading with guide rail and ball screw drive

High-speed brushless DC motor spindle with digital display

Self-developed thin-film dispensing pump with built-in suck-back

Dual-axis operation with dual hot plates for high efficiency

One-touch switch between automatic and manual dispensing

Thyristor-controlled hot plate with overtemperature protection and pin lift mechanism