Auto Developer

Technical Specifications：

Wafer Size: 3–6 inches (round or square)

Nozzle Positioning Accuracy: ≤0.2 mm
Rotation Accuracy: ≤1–4%
Maximum Speed: 6,000 rpm
Acceleration: Adjustable within 0–5,000 rpm/sec
Process Uniformity: Within-wafer ≤0.04 μm, Wafer-to-wafer ≤0.08 μm
Equipment Reliability: MWBF ≥ 10,000 wafers
Application Areas: Integrated Circuits, Semiconductors, Silicon-based Microdisplays

Features of the equipment：

Standard cassette storage for wafers – automatic loading/unloading.

Dual-track design for increased production efficiency.
Wafer transfer methods: belt transfer (Type 86) and robot arm transfer (Type 88).
Spindle uses high-speed servo motor with digital display for precise speed control.
Control system: PLC touchscreen – low failure rate, high reliability, simple operation, easy maintenance.
Spray developing: two chemical tanks, one nitrogen line. Process lines can also be customized according to customer requirements.