3-Tube Horizontal CVD

Technical Specifications：

Wafer Size: 4–6 inches
Applicable Material: Silicon
Applicable Processes: SIPOS, POLY, Si₃N₄, PSG, LTO, TEOS
Application Areas: Integrated Circuits, Semiconductors, Silicon-based Microdisplays

Features of the equipment：

High-precision computer-controlled technology enables full-process monitoring.
Software is expandable to support MES and SECS functions.
All major components are sourced from internationally recognized leading brands. 
Excellent thin film uniformity.

Advanced control software operating system.